FPT is trialling a semiconductor testing and packaging plant at Yên Phong II-C Industrial Park in Bắc Ninh, the Government News reported. The 1,600-square-metre facility initially focuses on chip functionality, quality and reliability testing.
Capacity is not delivered output
The report gives a maximum capacity of 300 million chips a year during the trial phase. That is stated capability, rather than chips already tested or delivered. It provides no actual output or utilisation figure.
The facility occupies the testing and packaging stages of the semiconductor chain. It should not be described as a wafer-fabrication plant. Its intended contribution to domestic testing capability remains an expected role, not a measured completed outcome.
The plant is oriented towards international quality, environmental and occupational-safety management standards. That wording does not establish that every relevant certification has already been obtained.
Automated equipment needs chip-specific programmes
An ATE Tester checks chip functions and operation, while a Handler positions devices and sorts them according to test results. Testing takes place in a Class 10,000 cleanroom, equivalent to ISO Class 7, to control dust and environmental conditions.
FPT engineers develop programmes for each chip type because technical requirements differ. The next commercial step described is a planned first testing order for a South Korean partner. The source does not confirm its completion or delivery. Trial operations and actual service execution will therefore show how the stated capacity translates into business activity.